Vulnerability Description
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
CVSS Score
HIGH
Affected Products
| Vendor | Product | Versions |
|---|---|---|
| Linux | Linux Kernel | >= 3.0, <= 3.19.8 |
Related Weaknesses (CWE)
References
- http://www.securityfocus.com/bid/92381Third Party AdvisoryVDB Entry
- https://us.codeaurora.org/cgit/quic/la/kernel/msm-3.10/commit/?id=ab3f46119ca10dMailing ListPatchThird Party Advisory
- https://www.codeaurora.org/stack-overflow-msm-thermal-driver-allows-kernel-memorBroken Link
- http://www.securityfocus.com/bid/92381Third Party AdvisoryVDB Entry
- https://us.codeaurora.org/cgit/quic/la/kernel/msm-3.10/commit/?id=ab3f46119ca10dMailing ListPatchThird Party Advisory
- https://www.codeaurora.org/stack-overflow-msm-thermal-driver-allows-kernel-memorBroken Link
FAQ
What is CVE-2016-2063?
CVE-2016-2063 is a vulnerability with a CVSS score of 7.8 (HIGH). Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) A...
How severe is CVE-2016-2063?
CVE-2016-2063 has been rated HIGH with a CVSS base score of 7.8/10. Review the CVSS metrics above for detailed severity breakdown.
Is there a patch for CVE-2016-2063?
Check the references section above for vendor advisories and patch information. Affected products include: Linux Linux Kernel.