Vulnerability Description
In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.
CVSS Score
HIGH
Affected Products
| Vendor | Product | Versions |
|---|---|---|
| Qualcomm | Sd 425 Firmware | - |
| Qualcomm | Sd 425 | - |
| Qualcomm | Sd 427 Firmware | - |
| Qualcomm | Sd 427 | - |
| Qualcomm | Sd 430 Firmware | - |
| Qualcomm | Sd 430 | - |
| Qualcomm | Sd 435 Firmware | - |
| Qualcomm | Sd 435 | - |
| Qualcomm | Sd 450 Firmware | - |
| Qualcomm | Sd 450 | - |
| Qualcomm | Sd 625 Firmware | - |
| Qualcomm | Sd 625 | - |
| Qualcomm | Sd 810 Firmware | - |
| Qualcomm | Sd 810 | - |
| Qualcomm | Sd 820 Firmware | - |
| Qualcomm | Sd 820 | - |
| Qualcomm | Sd 835 Firmware | - |
| Qualcomm | Sd 835 | - |
| Qualcomm | Sdm630 Firmware | - |
| Qualcomm | Sdm630 | - |
Related Weaknesses (CWE)
References
- https://www.qualcomm.com/company/product-security/bulletinsVendor Advisory
- https://www.qualcomm.com/company/product-security/bulletinsVendor Advisory
FAQ
What is CVE-2017-18173?
CVE-2017-18173 is a vulnerability with a CVSS score of 7.8 (HIGH). In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, ...
How severe is CVE-2017-18173?
CVE-2017-18173 has been rated HIGH with a CVSS base score of 7.8/10. Review the CVSS metrics above for detailed severity breakdown.
Is there a patch for CVE-2017-18173?
Check the references section above for vendor advisories and patch information. Affected products include: Qualcomm Sd 425 Firmware, Qualcomm Sd 425, Qualcomm Sd 427 Firmware, Qualcomm Sd 427, Qualcomm Sd 430 Firmware.