HIGH · 7.8

CVE-2017-18297

Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820.

Vulnerability Description

Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820.

CVSS Score

7.8

HIGH

CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Attack Vector
LOCAL
Attack Complexity
LOW
Privileges Required
LOW
User Interaction
NONE
Scope
UNCHANGED
Confidentiality
HIGH
Integrity
HIGH
Availability
HIGH

Affected Products

VendorProductVersions
QualcommSd 425 Firmware-
QualcommSd 425-
QualcommSd 430 Firmware-
QualcommSd 430-
QualcommSd 450 Firmware-
QualcommSd 450-
QualcommSd 625 Firmware-
QualcommSd 625-
QualcommSd 650 Firmware-
QualcommSd 650-
QualcommSd 652 Firmware-
QualcommSd 652-
QualcommSd 820 Firmware-
QualcommSd 820-

Related Weaknesses (CWE)

References

FAQ

What is CVE-2017-18297?

CVE-2017-18297 is a vulnerability with a CVSS score of 7.8 (HIGH). Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820.

How severe is CVE-2017-18297?

CVE-2017-18297 has been rated HIGH with a CVSS base score of 7.8/10. Review the CVSS metrics above for detailed severity breakdown.

Is there a patch for CVE-2017-18297?

Check the references section above for vendor advisories and patch information. Affected products include: Qualcomm Sd 425 Firmware, Qualcomm Sd 425, Qualcomm Sd 430 Firmware, Qualcomm Sd 430, Qualcomm Sd 450 Firmware.