HIGH · 7.0

CVE-2017-18305

XBL sec mem dump system call allows complete control of EL3 by unlocking all XPUs if enable fuse is not blown in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/...

Vulnerability Description

XBL sec mem dump system call allows complete control of EL3 by unlocking all XPUs if enable fuse is not blown in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835.

CVSS Score

7.0

HIGH

CVSS:3.0/AV:L/AC:H/PR:L/UI:N/S:U/C:H/I:H/A:H
Attack Vector
LOCAL
Attack Complexity
HIGH
Privileges Required
LOW
User Interaction
NONE
Scope
UNCHANGED
Confidentiality
HIGH
Integrity
HIGH
Availability
HIGH

Affected Products

VendorProductVersions
QualcommMdm9206 Firmware-
QualcommMdm9206-
QualcommMdm9607 Firmware-
QualcommMdm9607-
QualcommMdm9650 Firmware-
QualcommMdm9650-
QualcommSd 210 Firmware-
QualcommSd 210-
QualcommSd 212 Firmware-
QualcommSd 212-
QualcommSd 205 Firmware-
QualcommSd 205-
QualcommSd 835 Firmware-
QualcommSd 835-

References

FAQ

What is CVE-2017-18305?

CVE-2017-18305 is a vulnerability with a CVSS score of 7.0 (HIGH). XBL sec mem dump system call allows complete control of EL3 by unlocking all XPUs if enable fuse is not blown in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/...

How severe is CVE-2017-18305?

CVE-2017-18305 has been rated HIGH with a CVSS base score of 7.0/10. Review the CVSS metrics above for detailed severity breakdown.

Is there a patch for CVE-2017-18305?

Check the references section above for vendor advisories and patch information. Affected products include: Qualcomm Mdm9206 Firmware, Qualcomm Mdm9206, Qualcomm Mdm9607 Firmware, Qualcomm Mdm9607, Qualcomm Mdm9650 Firmware.