CVE-2017-18309 — HIGH (7.1)

Vulnerability Description

A micro-core of QMP transportation may cause a macro-core to read from or write to arbitrary memory in Snapdragon Mobile in version SD 845, SD 850.

CVSS Score

7.1

HIGH

CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:N

Attack Vector

LOCAL

Attack Complexity

LOW

Privileges Required

LOW

User Interaction

NONE

Scope

UNCHANGED

Confidentiality

HIGH

Integrity

HIGH

Availability

NONE

Affected Products

Vendor	Product	Versions
Qualcomm	Sd 845 Firmware	-
Qualcomm	Sd 845	-
Qualcomm	Sd 850 Firmware	-
Qualcomm	Sd 850	-

Related Weaknesses (CWE)

CWE-129

References

http://www.securitytracker.com/id/1041432Third Party AdvisoryVDB Entry
https://www.qualcomm.com/company/product-security/bulletinsVendor Advisory
http://www.securitytracker.com/id/1041432Third Party AdvisoryVDB Entry
https://www.qualcomm.com/company/product-security/bulletinsVendor Advisory

FAQ

What is CVE-2017-18309?

CVE-2017-18309 is a vulnerability with a CVSS score of 7.1 (HIGH). A micro-core of QMP transportation may cause a macro-core to read from or write to arbitrary memory in Snapdragon Mobile in version SD 845, SD 850.

How severe is CVE-2017-18309?

CVE-2017-18309 has been rated HIGH with a CVSS base score of 7.1/10. Review the CVSS metrics above for detailed severity breakdown.

Is there a patch for CVE-2017-18309?

Check the references section above for vendor advisories and patch information. Affected products include: Qualcomm Sd 845 Firmware, Qualcomm Sd 845, Qualcomm Sd 850 Firmware, Qualcomm Sd 850.