CVE-2018-11862 — HIGH (7.8)

Vulnerability Description

Buffer overflow can happen in WLAN module due to lack of validation of the input length in Snapdragon Mobile in version SD 845, SD 850, SDA660.

CVSS Score

7.8

HIGH

CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Attack Vector

LOCAL

Attack Complexity

LOW

Privileges Required

LOW

User Interaction

NONE

Scope

UNCHANGED

Confidentiality

HIGH

Integrity

HIGH

Availability

HIGH

Affected Products

Vendor	Product	Versions
Qualcomm	Sd 845 Firmware	-
Qualcomm	Sd 845	-
Qualcomm	Sd 850 Firmware	-
Qualcomm	Sd 850	-
Qualcomm	Sda660 Firmware	-
Qualcomm	Sda660	-

Related Weaknesses (CWE)

CWE-119

References

http://www.securityfocus.com/bid/107681Third Party AdvisoryVDB Entry
https://www.qualcomm.com/company/product-security/bulletinsVendor Advisory
http://www.securityfocus.com/bid/107681Third Party AdvisoryVDB Entry
https://www.qualcomm.com/company/product-security/bulletinsVendor Advisory

FAQ

What is CVE-2018-11862?

CVE-2018-11862 is a vulnerability with a CVSS score of 7.8 (HIGH). Buffer overflow can happen in WLAN module due to lack of validation of the input length in Snapdragon Mobile in version SD 845, SD 850, SDA660.

How severe is CVE-2018-11862?

CVE-2018-11862 has been rated HIGH with a CVSS base score of 7.8/10. Review the CVSS metrics above for detailed severity breakdown.

Is there a patch for CVE-2018-11862?

Check the references section above for vendor advisories and patch information. Affected products include: Qualcomm Sd 845 Firmware, Qualcomm Sd 845, Qualcomm Sd 850 Firmware, Qualcomm Sd 850, Qualcomm Sda660 Firmware.