Vulnerability Description
The Texas Instruments OMAP L138 (secure variants) trusted execution environment (TEE) lacks a bounds check on the signature size field in the SK_LOAD module loading routine, present in mask ROM. A module with a sufficiently large signature field causes a stack overflow, affecting secure kernel data pages. This can be leveraged to obtain arbitrary code execution in secure supervisor context by overwriting a SHA256 function pointer in the secure kernel data area when loading a forged, unsigned SK_LOAD module encrypted with the CEK (obtainable through CVE-2022-25332). This constitutes a full break of the TEE security architecture.
CVSS Score
HIGH
Affected Products
| Vendor | Product | Versions |
|---|---|---|
| Ti | Omap L138 Firmware | - |
| Ti | Omap L138 | - |
Related Weaknesses (CWE)
References
- https://tetraburst.com/Not Applicable
- https://tetraburst.com/Not Applicable
FAQ
What is CVE-2022-25334?
CVE-2022-25334 is a vulnerability with a CVSS score of 8.2 (HIGH). The Texas Instruments OMAP L138 (secure variants) trusted execution environment (TEE) lacks a bounds check on the signature size field in the SK_LOAD module loading routine, present in mask ROM. A mod...
How severe is CVE-2022-25334?
CVE-2022-25334 has been rated HIGH with a CVSS base score of 8.2/10. Review the CVSS metrics above for detailed severity breakdown.
Is there a patch for CVE-2022-25334?
Check the references section above for vendor advisories and patch information. Affected products include: Ti Omap L138 Firmware, Ti Omap L138.