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HIGH · 7.8

CVE-2022-33217

Memory corruption in Qualcomm IPC due to buffer copy without checking the size of input while starting communication with a compromised kernel. in Snapdragon Mobile

Vulnerability Description

Memory corruption in Qualcomm IPC due to buffer copy without checking the size of input while starting communication with a compromised kernel. in Snapdragon Mobile

CVSS Score

7.8

HIGH

CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Attack Vector
LOCAL
Attack Complexity
LOW
Privileges Required
LOW
User Interaction
NONE
Scope
UNCHANGED
Confidentiality
HIGH
Integrity
HIGH
Availability
HIGH

Affected Products

VendorProductVersions
QualcommSd 8 Gen1 5G Firmware-
QualcommSm8475-
QualcommWcd9380 Firmware-
QualcommWcd9380-
QualcommWcn6855 Firmware-
QualcommWcn6855-
QualcommWcn6856 Firmware-
QualcommWcn6856-
QualcommWcn7850 Firmware-
QualcommWcn7850-
QualcommWcn7851 Firmware-
QualcommWcn7851-
QualcommWsa8830 Firmware-
QualcommWsa8830-
QualcommWsa8835 Firmware-
QualcommWsa8835-

Related Weaknesses (CWE)

CWE-120

References

FAQ

What is CVE-2022-33217?

CVE-2022-33217 is a vulnerability with a CVSS score of 7.8 (HIGH). Memory corruption in Qualcomm IPC due to buffer copy without checking the size of input while starting communication with a compromised kernel. in Snapdragon Mobile

How severe is CVE-2022-33217?

CVE-2022-33217 has been rated HIGH with a CVSS base score of 7.8/10. Review the CVSS metrics above for detailed severity breakdown.

Is there a patch for CVE-2022-33217?

Check the references section above for vendor advisories and patch information. Affected products include: Qualcomm Sd 8 Gen1 5G Firmware, Qualcomm Sm8475, Qualcomm Wcd9380 Firmware, Qualcomm Wcd9380, Qualcomm Wcn6855 Firmware.