CVE-2025-21461 — HIGH (7.8)

Vulnerability Description

Memory corruption when programming registers through virtual CDM.

CVSS Score

7.8

HIGH

CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Attack Vector

LOCAL

Attack Complexity

LOW

Privileges Required

LOW

User Interaction

NONE

Scope

UNCHANGED

Confidentiality

HIGH

Integrity

HIGH

Availability

HIGH

Affected Products

Vendor	Product	Versions
Qualcomm	Fastconnect 6900 Firmware	-
Qualcomm	Fastconnect 6900	-
Qualcomm	Fastconnect 7800 Firmware	-
Qualcomm	Fastconnect 7800	-
Qualcomm	Sm6650 Firmware	-
Qualcomm	Sm6650	-
Qualcomm	Sm7635 Firmware	-
Qualcomm	Sm7635	-
Qualcomm	Sm7675 Firmware	-
Qualcomm	Sm7675	-
Qualcomm	Sm7675P Firmware	-
Qualcomm	Sm7675P	-
Qualcomm	Sm8635 Firmware	-
Qualcomm	Sm8635	-
Qualcomm	Sm8635P Firmware	-
Qualcomm	Sm8635P	-
Qualcomm	Snapdragon 8 Gen 1 Mobile Platform Firmware	-
Qualcomm	Snapdragon 8 Gen 1 Mobile Platform	-
Qualcomm	Snapdragon 8 Gen 3 Mobile Platform Firmware	-
Qualcomm	Snapdragon 8 Gen 3 Mobile Platform	-

Related Weaknesses (CWE)

CWE-787

References

https://docs.qualcomm.com/product/publicresources/securitybulletin/august-2025-bVendor Advisory

FAQ

What is CVE-2025-21461?

CVE-2025-21461 is a vulnerability with a CVSS score of 7.8 (HIGH). Memory corruption when programming registers through virtual CDM.

How severe is CVE-2025-21461?

CVE-2025-21461 has been rated HIGH with a CVSS base score of 7.8/10. Review the CVSS metrics above for detailed severity breakdown.

Is there a patch for CVE-2025-21461?

Check the references section above for vendor advisories and patch information. Affected products include: Qualcomm Fastconnect 6900 Firmware, Qualcomm Fastconnect 6900, Qualcomm Fastconnect 7800 Firmware, Qualcomm Fastconnect 7800, Qualcomm Sm6650 Firmware.