Vulnerability Description
In the Linux kernel, the following vulnerability has been resolved: RDMA/hns: Fix memory leak of bonding resources In a corner case of concurrent driver removal and driver reset, bonding resource is first released in hns_roce_hw_v2_exit() during driver removal, and then is allocated again in hns_roce_register_device() during driver reset. This leads to memory leak because the release timing has already passed. This may also lead to a kernel panic as below because of the leaked notifier callback: Call trace: 0xffffa20fccc04978 (P) raw_notifier_call_chain+0x20/0x38 call_netdevice_notifiers_info+0x60/0xb8 netdev_lower_state_changed+0x4c/0xb8 As Sashiko suggested, the teardown order of bonding resources should be inverted to make sure the resources are released when the driver is removed.
References
- https://git.kernel.org/stable/c/bc4caea7a82bbcf94a34eff7094e7f9b501680ab
- https://git.kernel.org/stable/c/c0bd03b850d81a8914168d87ddf7f6ffa58875ef
FAQ
What is CVE-2026-80625?
CVE-2026-80625 is a documented vulnerability. In the Linux kernel, the following vulnerability has been resolved: RDMA/hns: Fix memory leak of bonding resources In a corner case of concurrent driver removal and driver reset, bonding resource is...
How severe is CVE-2026-80625?
CVSS scoring is not yet available for CVE-2026-80625. Check NVD for updates.
Is there a patch for CVE-2026-80625?
Check the references section above for vendor advisories and patch information. Review vendor security bulletins for remediation guidance.